Advanced Electro-thermal Modeling for Surface Mount Resistors
نویسندگان
چکیده
Exceeding component maximum ratings due to transient events like current spikes can lead to premature failure of surface mount resistors due to thermal and electrical overstress. In order to accurately evaluate device parameters and their impact on the circuit behavior a coupled electro-thermal simulation method must be applied under the influence of packaging. This article presents an analysis method for electro-thermal transient interaction for resistors, based on thermal impedance modeling using RC network synthesis and SPICE circuit solver simulation. The described approach enables the simultaneous analysis of film temperature and resistance variations, presenting interest for applications in which the thermal behavior of fixed resistors can have important consequences on the functional parameters of the circuit.
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